Microchip Launches 3.3 kV HV-D3 mSiC Power Modules to Enable Solid-State Transformer Applications in AI Data Centers
Microchip Launches 3.3 kV HV-D3 mSiC® Power Modules to Enable Solid-State Transformer Applications in AI Data Centers
— New silicon carbide modules deliver the thermal performance and efficiency required to enable solid-state transformers (SSTs) to free up more power for token generation
Microchip Technology Inc. today announced the launch of its new 3.3 kV HV-D3 mSiC® power modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) in AI hyperscale data centers and other high-voltage power applications. The new modules are offered in an industry-standard 62 mm package and integrate 3.3 kV silicon carbide (SiC) mSiC MOSFETs and Schottky diodes, enabling efficient power delivery directly from the medium-voltage grid to server racks.
As AI data centers continue to scale, token generation capacity is constrained by power delivery, and energy efficiency directly determines return on investment. Traditional architectures rely on bulky low-frequency transformers, which increase system complexity, add losses and limit flexibility. Solid-state transformers are a fundamental innovation in power transmission, reducing the number of power conversion stages and improving system efficiency. Next-generation AI infrastructure is progressively shifting toward high-voltage DC rack power distribution, further highlighting the value of solid-state transformers. They can deliver regulated DC power directly from the medium-voltage grid, significantly simplifying the conversion chain.
Microchip's HV-D3 mSiC modules are designed specifically to meet these requirements. They leverage Microchip's mSiC MOSFET technology to deliver excellent on-resistance (RDS(on)) stability across the entire operating temperature range; the package supports a 6 kV insulation rating, uses Comparative Tracking Index (CTI) 600-grade material and offers scalable creepage distance to ensure safe and reliable high-voltage series connections. The silicon nitride (Si₃N₄) substrate provides excellent thermal conductivity and strong power cycling capability, helping designers reduce cooling requirements while achieving higher power density.
"As AI data centers continue to push the limits of grid-to-GPU power delivery, solid-state transformers are becoming increasingly important," said Clayton Pillion, Vice President of Microchip's High Power Solutions business unit. "Our 3.3 kV HV-D3 mSiC power modules can reduce the number of series-connected devices by approximately half compared with low-voltage silicon carbide solutions when interfacing with 13.8 kV or 34.5 kV grids. This product fills the gap for 100-300 ampere power devices in the industrial market, providing an ideal transition between discrete SiC devices and large power modules."
HV-D3 mSiC power modules are available in half-bridge and common-source configurations, with or without antiparallel Schottky diodes, covering 100-300 ampere application scenarios. Microchip mSiC MOSFET technology offers balanced switching losses in both hard-switching and soft-switching topologies, making it well suited for solid-state transformer designs and other high-frequency, high-voltage systems.
HV-D3 mSiC power modules are optimized for solid-state transformers in AI data centers and are also suitable for a broad range of applications, including megawatt-scale charging infrastructure for heavy-duty vehicles, auxiliary power supplies for rail/heavy transport, medium-voltage motor drives, and industrial and defense power systems. These applications also benefit from their excellent insulation performance, more reliable thermal ruggedness and more efficient power conversion.
Microchip has more than 20 years of experience in the development, design, manufacturing and support of SiC devices and power solutions, committed to helping customers adopt SiC technology easily, quickly and reliably. The company's mSiC products and solutions are designed to reduce system cost, accelerate time to market and lower risk. Microchip offers a broad and flexible portfolio of SiC diodes, MOSFETs and gate drivers. For more information, please visit www.microchip.com/sic.
The 3.3 kV power modules are supported by application notes, design guides, device models and simulation models to support rapid prototyping. Microchip also provides global technical support, design services and field application engineering support.
The 3.3 kV mSiC power modules are now available for volume purchase. They can be purchased directly from Microchip, or by contacting a Microchip sales representative or worldwide authorized distributor.
About Microchip Technology Inc.
Microchip Technology Inc. is a leading provider of smart, connected and secure embedded control solutions. Its easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company's solutions serve more than 125,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, Microchip offers outstanding technical support along with dependable delivery and quality. For more information, visit the Microchip website at www.microchip.com.