
Hercules Microelectronics (Beijing) Co., Ltd. is registered in the Beijing Economic-Technological Development Area, with its headquarters in Yizhuang and an R&D center in Zhongguancun; it has technical support, marketing and R&D teams in Shanghai, Shenzhen, Wuhan, Qingdao and other locations.
Hercules Microelectronics is one of the earliest domestic enterprises to enter independent R&D, large-scale production and volume sales of general-purpose FPGA chips and next-generation heterogeneous programmable computing chips. The company holds more than 200 patents and possesses independent and complete intellectual property rights, covering full-stack technical fields including FPGA core design, SOC architecture design, chip development, EDA software development, and IP development and integration.
The company's products integrate FPGA with multiple heterogeneous units such as CPU, MCU, Memory, ASIC and AI on a single chip, achieving features including programmability, self-reconfiguration, easy scalability, broad applicability, multi-integration, high reliability, strong computing power and long lifecycle, providing users with cost-effective system solutions.
The company has established four major product directions, including:
① High-end FPGA chips for data centers/electric vehicles/5G;
② AiPGA (AI in FPGA) chips for artificial intelligence;
③ Heterogeneous computing FPGA and HPA (Heterogeneous Programmable Accelerator) chips for new infrastructure/industrial IoT;
④ eFPGA (embedded FPGA) cores for embedded applications, with markets covering core infrastructure such as national communications/industry/security/power/medical/consumer.
The China Graduate IC Innovation Competition has specially invited senior chip experts from Hercules Microelectronics to present a dedicated session on the company's competition topics for participating students!

April 12, 2022 (Tuesday)
14:00 - 15:00 PM

Primarily engaged in architecture design of FPGA devices and design of FPGA DSP digital signal processing modules;
Main research directions: commercial FPGA EDA tools and development methodologies, high-speed Transceiver and DDR memory interfaces, FPGA routing architecture.
Primarily responsible for IC design and FPGA/SoC architecture design. Participated as a key technical member in the National 12th Five-Year Plan core high-end general chips project, filling the gap in China's commercial mid-to-high-end programmable logic devices, and filed multiple invention patents;
Nearly 20 years of dual R&D experience in ASIC/SoC and FPGA, with multiple successful mass production experiences.
Topic 2: Design of a Level-2 Cache Based on AXI Bus Interface
yunqin.li@hercules-micro.com
Hercules Microelectronics Enterprise Topic Special Awards:
First Prize: 1 team, prize of 10,000 RMB


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