A domestic vendor that has already brought 28nm large-capacity FPGAs into mass production has put its next-generation 12nm product on display at its Munich booth. For domestic engineers working on high-speed interfaces and boards, what is really worth watching is not booth traffic but the fact that this company has moved one step forward on process node, and that the step is built on existing mass-production experience.
Xi'an Zhiduojing exhibited its 12nm FPGA core products at electronica 2026, which opened on November 10 and runs through November 13. The positioning given in the material is that it is one of the few domestic manufacturers to achieve mass production of 28nm large-capacity FPGAs. The official statement is that the new products achieve key upgrades in compute power, power consumption, and integration, covering industrial control, communications, and automotive electronics. What can be confirmed here is the node advance and the target scenarios; specific logic scale, SerDes rates, and power figures have not been disclosed, so booth information cannot be used as a datasheet when selecting parts.
On the first day of the show, booth visitors came from Europe and Asia-Pacific, and discussions centered on chip performance, localized technical support, and customized adaptation solutions. These three items happen to be the areas where major overseas vendors have relatively thin coverage for small and medium-sized domestic customers. Zhiduojing's statement is that it will use the exhibition to connect with global ecosystem partners and promote the adoption of domestic FPGAs in more scenarios. For board designers, localized support and customized adaptation are the most practical considerations when switching solutions, but the material does not provide verifiable data on metrics such as support response speed and adaptation cycle.
In the short term, this news does not constitute a reason to switch solutions: the 12nm product is at the exhibition stage, and logic scale, interface rates, packaging, and power consumption have not been made public, making item-by-item comparison with existing devices impossible. For teams working on high-speed interfaces and boards, the actionable move is to put this vendor on the watchlist for domestic substitution, with focus on two things: the actual delivery and toolchain maturity of the 28nm large-capacity platform, and when the 12nm product will provide evaluable specifications. On the supply chain side, one more mass-producible local node option is indirectly beneficial for lead-time negotiations; whether the toolchain is compatible with existing flows is not mentioned in the material and needs to be verified independently.