Hercules Micro at ICCAD 2023: Continued 22nm Innovation Opens New Domestic FPGA Applications
On November 10-11, the 2023 ICCAD, a premier event for China's IC design industry, was successfully held at the Poly World Trade Center Expo in Guangzhou under the theme "Bay Area With You, Chips Toward the Future." As a key player and one of the representative companies in domestic FPGA chips, Hercules Micro made a strong showing at the event with multiple chips, innovative achievements, and a broad range of solutions. During the same period, the company was invited to speak at the "IC Design and Innovative Applications" forum, where it discussed FPGA application areas and development trends with industry peers, and shared its latest corporate updates and technology roadmap.
During the exhibition, Professor Wei Shaojun, Chairman of the IC Design Branch of the China Semiconductor Industry Association, visited the Hercules Micro booth to offer guidance. He fully affirmed the importance of FPGA as a unique segment within China's broader IC industry, encouraged the company to keep up its momentum, and expressed high expectations for its future development.
Upholding Integrity and Innovation, Quality First: Delivering Comprehensive and Reliable Solutions for Automotive Customers
As the wave of intelligentization sweeps across industries, the rapid development of smart vehicles has created a new cross-industry convergence between "chips" and "automobiles." Automotive-grade chips have become a hot track in domestic chip development. However, the complex and variable operating environment of vehicles demands that core automotive components maintain stable operation under harsher conditions, imposing higher standards on chip stability, security, reliability, and other performance metrics. With their powerful data processing capabilities, real-time performance, reliability, and security, FPGAs are leveraging their unique advantages to meet the demands of the smart automotive sector.
Zhao Wei, Production Operations Director of Hercules Micro, stated: "Hercules Micro's H1 series products have completed and passed automotive-grade testing. They have achieved automotive-level application standards in terms of product safety, reliability, and power consumption, marking Hercules Micro's entry into the automotive-grade semiconductor field. Hercules Micro is committed to close collaboration with upstream and downstream partners, continuously optimizing products to meet more automotive application requirements and to contribute to accelerating the development of domestic smart vehicles."
In the product introduction session, Zhao Wei also presented another chip that Hercules Micro launched this year and has already achieved mass production — the HME-P2 series (P2P50) FPGA. He noted that the HME-P2 series chips adopt low-power 22nm technology and integrate a high-performance Cortex-M3 MCU, peripherals, on-chip SRAM, and other functional blocks, supporting high-bandwidth MIPI and LVDS interfaces. They can be widely used in embedded vision applications and industrial control, among other fields. By leveraging the HME-P2 series' configurable soft-core IP, hard-core IP, MCU, and peripherals, designers can focus on their own application design and bring products to market efficiently and quickly.
Hercules Micro P2 Series Chip Development Board on Display
Focusing on Industry Development, Optimizing Corporate Products, Persisting in Chip Innovation
The accelerated pace of the domestic semiconductor industry means companies must continuously enhance their competitive advantages — a challenge and an opportunity for corporate development. Over the two-day exhibition, Hercules Micro showcased a variety of products and live demos targeting different application areas including industrial control, video imaging, and consumer electronics.
A Selection of Products and Application Solutions on Display at the Hercules Micro Booth
Grounded in the Present, Looking to the Future: Hercules Micro adheres to a product-centric approach, deepening its presence in the FPGA field and continuously innovating and optimizing technology to meet the needs of more application areas. The company is committed to providing customers with broader, more reliable, stable, and flexible solutions, contributing core strength to the high-quality development of the domestic semiconductor industry.