Hercules Micro Launches China's First 22nm Low-Power High-Performance FPGA Chip

On August 18, 2022, Beijing, China — Hercules Microelectronics (HME), a domestic supplier of independently developed high-end general-purpose FPGA chips and next-generation heterogeneous programmable computing chips, announced the launch of its new Hercules H series product, the H3C08 chip (H3 series product). This chip is China's first FPGA chip based on a 22nm process that has been successfully mass-produced.

Hercules H Series New Generation Product — H3C08

The Hercules H series new generation product — H3C08 adopts 6K LUT6 (equivalent to 8K LUT4), with performance up to 250MHz, and supports hard-core MIPI D-PHY Tx with interface rates up to 2.5Gbps. As an FPGA chip based on a heterogeneous architecture, the H3 series product is equipped with 8K high-performance programmable logic resources, 5MB embedded SRAM memory modules, dedicated image/video processing modules, and also integrates a 32-bit high-performance processor — Cortex-M3 MCU — along with rich peripherals, achieving a perfect combination of MCU, SRAM, MIPI, ASIC and FPGA, further enhancing the product's processing efficiency, operational flexibility, module scalability and functional integration across multiple applications.

"As a unique low-power, high-performance FPGA chip, the H3C08 is designed to help customers rapidly implement ultra-high cost-effective application solutions, deeply explore the uniqueness and synergy of functions such as FPGA, MCU, SRAM, MIPI and ASIC, further enhance the competitiveness of customers' terminal products, and effectively help customers shorten their time-to-market," said Wang Leilei, Sales Director of Hercules Microelectronics. "The H3C08 chip can be widely used in next-generation consumer terminals, display bridging, AR&VR and many other applications, continuing to expand the market reach of domestic FPGA chips."

The all-new H3 series product is the industry's first FPGA product to adopt advanced 22nm low-power high-performance technology. While enhancing chip processing capability, it can reduce power consumption and shrink size, giving the product both high performance and low power characteristics. It achieves data transmission with interface rates up to 2.5Gbps and data processing with core speeds above 200MHz, capable of meeting the requirements of various specialized, personalized, complex and refined application scenarios, providing customers with more space to focus on their own application design and profit growth.

The H3C08 chip product has now fully achieved mass production. Early adopters are welcome to trial and order.