Anlogic Showcases at ICDIA2026 and Wins Strong Chip TOP100 Award

Anlogic Showcases at ICDIA2026 and Wins Strong Chip TOP100 Award

Release Date: 2026-08-24

On August 20, the "2026 China Integrated Circuit Innovation Conference (ICDIA 2026)" was held in Nanjing. Anlogic's SALELF fifth-generation FPGA EF5 series was honored with the "2026 Strong Chip TOP100 — Innovation Breakthrough Award" for its technological innovation and market achievements. Wu Zhi, Vice President of Anlogic, attended the conference and received the award on behalf of the company.

The China Strong Chip selection is comprehensively reviewed by former nuclear high-base experts, the Design Alliance expert panel, editorial board experts of "China Integrated Circuit," representatives of system manufacturers, and media experts. It aims to select innovative IC products with leading technology, strong competitiveness, and reliable quality, providing system manufacturers and end users with references for selecting high-quality domestic chips and accelerating the process of domestic substitution of integrated circuits.

EF5: A New Generation of Low-Power Small-Capacity FPGA, Deeply Cultivating the Server and Data Center Field

The EF5 series adopts a 55 nm low-power process and fully forward-developed proprietary core technology, with capacity density covering 2.5 K–15 K LUTs. It integrates multiple hard-core interfaces such as SPI, I2C, and I3C, as well as dual 12-bit ADCs, making it the FPGA product with the highest density among domestic low-power small-capacity FPGAs.

It features a built-in enhanced SEU safety design, supporting error detection and correction as well as dynamic background refresh, and is compatible with Dual Boot and Multi Boot multiple startup modes. Each chip has a built-in unique 64-bit DNA serial number, meeting design requirements for functional safety, redundant backup, and information encryption. The accompanying proprietary EDA development software TangDynasty® has also received dual international top-level certifications — ISO 26262 (functional safety ASIL D) and IEC 61508 (SIL 4) — providing a solid, independently controllable toolchain support. Currently, the EF5 series has achieved mass production and has been adopted by multiple leading customers in industries such as servers and communications, with mass production shipments underway, making it an important force for domestic FPGAs in this market segment.

Wu Zhi, Vice President of Anlogic, attended the event in person to receive the award and participate in exchanges. He stated: "The rapid ramp-up of the EF5 series in fields such as servers confirms Anlogic's differentiated competitiveness in the high-reliability, low-power FPGA track. We will continue to increase R&D investment and serve the wave of domestic substitution and intelligent upgrading with a more complete product matrix."

At the concurrent exhibition, Anlogic highlighted customized FPGA solutions for fields such as automotive rearview mirrors and LiDAR. The automotive electronic rearview mirror solution based on Anlogic chips captures images through high-definition cameras, presenting highly real-time exterior images, effectively reducing blind spots, and meeting drivers' real-time needs. It offers strong scalability, allowing the addition of edge-computing-based automatic vehicle detection and alarm functions, and facilitates BSD functionality and multi-channel video expansion. Through years of dedicated layout, Anlogic has built a complete automotive electronics technology chain of "chip-solution-terminal," and some automotive-grade products have already been commercially deployed in large volumes at mainstream domestic automakers.

In the future, Anlogic will continue to strengthen industrial chain collaboration, accelerate expansion into emerging scenarios such as edge AI, intelligent robots, and servers, and promote mass production and delivery of automotive-grade products in more vehicle programs, contributing to the high-quality development of the domestic FPGA industry with more reliable, more efficient, and more independent Chinese "chips."

● Detailed Performance of SALELF® Series Fifth-Generation FPGA Products

● Understanding SALPHOENIX® 1P Series FPGA in One Infographic

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