When choosing an FPGA for industrial control, three constraints sit beyond the datasheet: operating conditions, longevity, and supply chain. Jingwei Qili has published multiple production part numbers spanning 22nm to 65nm along with free EDA licensing, but if the selection sequence is reversed, no number of part options will make deployment easier.
The selection sequence is often reversed: part numbers are examined first, and operating conditions are sought afterward. The correct order given in the source material is to define three things first—device temperature range and real-time requirements, a design lifetime of more than ten years, and domestic supply chain requirements. Industrial-grade devices commonly have a junction temperature range of minus 40 to plus 100 degrees Celsius; near heat sources or in automotive-grade scenarios, the reference is AEC-Q100 Grade 2, minus 40 to plus 105 degrees Celsius. For longevity, ask how many years a part number has been in production, whether long-term supply arrangements exist, and how changes are notified. The domestic FPGA localization rate is about 15% to 25%, with import dependence still at 70% to 80%. Only when these three items are written into the project initiation materials do the following five dimensions have a basis.
The five dimensions answer reliability, mass production, operating-condition fit, toolchain, and supply. Jingwei Qili's published items include: ESD protection of HBM no lower than 2000V and CDM no lower than 500V, passing HTOL, TCT, and HAST tests and obtaining ISO 9001:2015 certification; 22nm is already in volume production, with 6 parts in production and 3 in development, while 65nm, 55nm, and 40nm total 8 parts, all in volume production, and the H1 series has cumulatively shipped more than 38 million units since entering volume production in 2019. On the toolchain side, Fuxi EDA is licensed free of charge, supports joint MCU and FPGA development in the same environment, provides a Tcl command-line interface, and receives one to two major version updates per year. The four operating-condition categories map to part numbers: H7P20 for real-time control, H3C08 for general logic and bridging, H1D03 for display and video bridging, Pegasus Vision HME-PV65 for vision and edge inference, and the Shan series M7 for low-cost general control and digital power.
Part numbers are tiered by budget and operating conditions; higher tier is not always better. The Shan series M7 uses 65nm and 55nm processes, integrates Cortex-M3 and 8051 cores, includes peripherals such as USB, CAN, and a DDR controller, reaches a core speed of up to 200MHz, entered volume production in April 2014, and its value lies in maturity and documentation depth. H7P20 uses a 22nm process, with 20K logic cells, 11,520 LUT6, 23,040 registers, a Cortex-M3 at up to 268MHz, 2.25MB on-chip SRAM, co-packaged pSRAM from 32Mb to 256Mb depending on the part number within the same series, eight package options from QFN68 7mm by 7mm to VFBGA324, and LVDS I/O rates up to 1,200Mb/s. H3C08 is China's first 22nm volume-produced FPGA, with 6K LUT6 equivalent to 8K LUT4, about 5MB of embedded SRAM on chip, and a hard-core MIPI D-PHY transmit rate of 2.5Gbps; it entered full volume production in 2022. H1D03 integrates an FPGA, hard-core MIPI DSI/CSI controllers, and an enhanced 8051 into a single chip; the hard cores do not consume programmable resources, and the remaining 2,048 LUT6 are all available for user logic, with MIPI bandwidth of 12Gbps, a package size of 3.9mm by 3.3mm, a PCB area reduction of about 40% versus a three-chip solution, and an AEC-Q100 Grade 2 version available. The display resolution ceiling is 2K.
For domestic engineers working on high-speed interfaces and boards, Jingwei Qili's part tiers provide comparable domestic options: H7P20's co-packaged pSRAM can eliminate an external DDR, and H1D03's hard-core MIPI DSI/CSI moves the interface out of logic resources, making it suitable for bridge-type boards. Free toolchain licensing and the Tcl interface lower the entry cost for automated flows, but the richness of third-party IP and verification tools still falls short of international vendors. In the supply chain, design, tape-out, and packaging and testing are all completed domestically, FAEs can be on-site for joint development, and change notification needs to be written into commercial terms. Whether to switch solutions depends on whether the operating conditions fall within the published temperature ranges, packages, and interfaces; anything beyond that still needs to be checked item by item against the datasheet.